Chemical processes

The company name – Surface Chemistry – says it all. When it comes to surface problems, there are often more elegant and efficient chemical solutions, such as etching, special adhesion promoters, or chemical vapor deposition – beyond the more conventional physical methods like abrasive blasting, vapor coating, or sputtering. By combining chemical and physical methods (vapor coating and plasma), these reactions can be accelerated or given a special direction (anisotropic procedures).

Surface Chemistry aims to determine the most suitable method for the problem at hand, choosing from a whole range of them, and when required or advisable, optimizing that method with special plasma equipment.

Plasma devices that work at atmospheric pressure are especially interesting since they typically do not require a closed chamber and they pose a much smaller interruption in the production process.

What remains important in any case is testing to determine whether a plasma-supported procedure makes sense in the particular instance.

With demanding surface chemistry, use of plasma can sometimes be more of a disruption than a boon. In that case, a vapor deposition process with specially selected chemicals may be preferable.

As a rule, vapor deposition requires a closed chamber and typically an appropriate vacuum as well.

More recent experiments have shown, however, that some processes that are sufficiently reactive can be performed using a wet application. These are already state of the art.